山東力冠升級(jí)PVT設(shè)備,引領(lǐng)8-12英寸碳化硅晶圓高效量產(chǎn)
2025-07-30
為突破大尺寸碳化硅(SiC)晶圓在生長(zhǎng)效率、均勻性控制及成本方面的關(guān)鍵瓶頸,山東力冠微電子裝備有限公司近日正式發(fā)布其12英寸PVT電阻設(shè)備及8英寸多坩堝設(shè)備。為8-12英寸SiC晶圓的規(guī)模化、穩(wěn)定化、低成本制備樹立了新的行業(yè)標(biāo)桿。
均勻性保障:集成先進(jìn)多溫區(qū)精準(zhǔn)控制技術(shù),有效確保晶格質(zhì)量與厚度一致性,滿足嚴(yán)苛的量產(chǎn)質(zhì)量要求。
效率倍增,成本銳減:
山東力冠微電子裝備憑借其深厚的技術(shù)積淀和快速響應(yīng)的市場(chǎng)策略,已與國(guó)內(nèi)多家頭部半導(dǎo)體企業(yè)建立起深度合作關(guān)系,并正積極拓展全球市場(chǎng),國(guó)際影響力穩(wěn)步提升。
展望未來,山東力冠微電子裝備將持續(xù)聚焦大尺寸、高性價(jià)比PVT設(shè)備的研發(fā)與迭代,致力于通過核心設(shè)備的技術(shù)突破,提升全球SiC產(chǎn)業(yè)鏈的效率與韌性,促進(jìn)供應(yīng)鏈多元化發(fā)展,為半導(dǎo)體材料的革新與廣泛應(yīng)用持續(xù)提供關(guān)鍵動(dòng)能。
Shandong Liguan Microelectronics Equipment Co., Ltd. Upgrades PVT Equipment, Pioneering High-Efficiency Mass Production of 8-12-Inch SiC Wafers
To address the key bottlenecks in the growth efficiency, uniformity control, and cost of large-size silicon carbide (SiC) wafers, Shandong Liguan Microelectronics Equipment Co., Ltd. has officially launched its 12-inch PVT resistance equipment and 8-inch multi-crucible equipment. This breakthrough sets a new industry benchmark for the large-scale, stable, and low-cost production of 8-12 inch SiC wafers.
Highlights of Equipment Upgrades
12-inch PVT Resistance Furnace: Targeting Mass Production Challenges
Capacity Leap: Single-run growth efficiency increased by 40%, significantly accelerating the industrialization of 12-inch SiC wafers.
Uniformity Assurance: Equipped with advanced multi-zone precision temperature control, ensuring consistent lattice quality and thickness to meet stringent mass production standards.
Shandong Liguan Microelectronics Equipment Co., Ltd. 12-inch PVT Resistance Furnace
8-Inch Multi-Crucible Solution: The Key Engine for Cost Reduction and Efficiency Improvement
Efficiency Doubled, Costs Sharply Reduced:
By utilizing 3-5 crucibles for simultaneous crystal growth, single-run production capacity is multiplied, significantly reducing the manufacturing cost per wafer.
Intelligent Precision Control:
Innovative hardware architecture combined with proprietary intelligent control software enables high-precision dynamic regulation of temperature and vacuum pressure.
Breakthrough in Thermal Field Uniformity:
Exclusive multi-crucible cooperative thermal field technology systematically addresses the long-standing issue of uneven heat distribution in traditional large-scale equipment.
Ensuring Process Stability:
A highly automated control system minimizes human intervention, guaranteeing high yield rates and batch-to-batch consistency.
Market Expansion and Innovation-Driven Growth
Shandong Liguan Microelectronics Equipment Co., Ltd. leveraging its profound technological expertise and agile market strategy, has established deep partnerships with multiple leading domestic semiconductor enterprises. The company is now actively expanding its global footprint, with steadily growing international influence.
Looking ahead, Shandong Liguan Microelectronics Equipment Co., Ltd. will remain committed to the R&D and iteration of large-scale, cost-effective PVT equipment. By driving breakthroughs in core technologies, the company aims to enhance the efficiency and resilience of the global SiC supply chain, promote supply chain diversification, and provide critical momentum for the innovation and widespread adoption of semiconductor materials.
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2025-04-30